| Description |
The STS Deep Reactive ion Etcher uses the Bosch process to cut deep, high aspect ratio channels in silicon. Used primarily for MEMs devices, the only materials permitted in this etcher are silicon wafers, photoresist and thin films of silicon dioxide and silicon nitride. All other materials are prohibited unless approved by FabLab staff. |
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| Location | FabLab |
ETCH Tunnel
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| Manufacturer |
Surface Technology Systems |
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| Staff Contact |
 Jonathan Hummeljhummel1@umd.edu 301 405-5017 |
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| Rates | UMD $75/hr External Non-profit / University $116/hr Small Commercial / MTECH $158/hr Large Commercial $220/hr No Charge $0/hr |
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| Reservations | No upcoming reservations at this time. Please login to make a reservation. |
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| External Materials |
If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring. |
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| Logs |
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| SOPs |
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| Manuals
You must have reservation permissions to view the manuals. Please login to view manuals. |
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| Recipes | STS Etching RecipesChamber Clean Procedure.doc (26 KB)DRIEconditioningrecipe.pdf (182.54 KB) STS reboot.doc (24.5 KB) |
