|Description||The Strasbaugh 6EC Chemical Mechanical Polisher (CMP) is used to remove thin layers of SiO2 on silicon wafers for planarization of devices and circuits. It is located in the subfab and is only available to users approved by and trained by FabLab staff.|
|Location||FabLab | Subfab|
|Reservations||No upcoming reservations at this time.
Please login to make a reservation.
If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.
You must have reservation permissions to view the manuals. Please login to view manuals.