May 18, 2024 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw B - Microautomation

Dicing saw "B" is not operational.

Water faults are intermittent and "STANDBY" button will allow a reset to start again.

Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes,

If you are cleaning afterwards, reserve solvent bench for at least 15 minutes.

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.

For training on the saw, please contact John Abrahams @ 5-6664.

Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.

Location FabLab | Dicing Room
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
No Charge
Reservations No upcoming reservations at this time.
Please login to make a reservation.
External Materials

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.

Mon, May 13, 2024
1:30 pm - 2:30 pm
Zhihao Song
View Reservation
Mon, May 13, 2024
10:00 am - 11:00 am
Daniel Lewis
View Reservation
Mon, Dec 04, 2023
11:00 am - 12:00 pm
Daniel Lewis
View Reservation
Mon, Nov 06, 2023
11:00 am - 11:30 am
Zhihao Song
View Reservation
Thu, Oct 26, 2023
12:30 pm - 2:30 pm
Daniel Lewis
View Reservation
Records to show:
bkside-02_sop.doc (2.37 MB)
index.php (38 B)

You must have reservation permissions to view the manuals. Please login to view manuals.


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