May 23, 2025 UMD Home NanoCenter AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
tcl@umd.edu
301-405-3642
Rates
Large Commercial
$242/hr
Small Commercial / MTECH
$166/hr
External Non-profit / University
$126/hr
UMD
$81/hr
No Charge
$0/hr
Reservations No upcoming reservations at this time.
Please login to make a reservation.
External Materials

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.

Logs
Tue, May 20, 2025
3:00 pm - 4:00 pm
Ghadah Alshalan
View Reservation
Tue, May 20, 2025
12:00 pm - 12:30 pm
Ryan Purcell
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Tue, May 20, 2025
10:00 am - 12:00 pm
Soumadeep Saha
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Al oxide etching
Fri, May 16, 2025
10:00 am - 12:00 pm
Soumadeep Saha
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Deleted by: Mark Lecates

Al oxide etching.
Thu, May 15, 2025
11:00 am - 11:30 am
Ryan Purcell
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Records to show:
SOPs
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)
Manuals

You must have reservation permissions to view the manuals. Please login to view manuals.

Recipes

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