Description | Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions. | |||||||||||||||
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Location | FabLab | Tool Prep Area | |||||||||||||||
Manufacturer |
Microautomation |
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Staff Contact |
John Abrahams jabrah@umd.edu 301-405-5018 |
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Rates | UMD $25/hr External Non-profit / University $38/hr Small Commercial / MTECH $58/hr Large Commercial $124/hr |
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Reservations | No upcoming reservations at this time. Please login to make a reservation. |
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External Materials |
If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring. |
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Logs |
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SOPs |
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Manuals
You must have reservation permissions to view the manuals. Please login to view manuals. |
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Recipes |