July 22, 2024 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw B - Microautomation
Description Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Please login to make a reservation.
External Materials

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.

Mon, Dec 03, 2018
12:30 pm - 2:45 pm
Jacqueline Hines
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Deleted by:

C1021 M1 dicing
Fri, Nov 09, 2018
9:15 am - 4:45 pm
Jacqueline Hines
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Deleted by:

R1024M4 dicing Added 1.25 hours to cover cost of 2 saw blades
Wed, Oct 10, 2018
3:30 pm - 4:00 pm
Yiwen Hu
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Deleted by: Yiwen Hu

Tue, Sep 25, 2018
2:30 pm - 4:00 pm
Julia Sell
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Deleted by:

Wed, Aug 29, 2018
3:00 pm - 3:15 pm
Blake Nuwayhid
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Deleted by:

Records to show:
bkside-03_sop.doc (2.37 MB)
index.php (38 B)

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