| Description |
The Trion RIE is used to remove photoresist residue. Plumbed with O2,CF4,CHF3 and Sf6 the Etcher is an aggressive etcher for any organic material. Can be used to etch thin layers of SiO2 ,SiN and Si |
|||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Location | FabLab |
ETCH Tunnel
|
|||||||||||||||
| Manufacturer |
|
|||||||||||||||
| Staff Contact |
 Mark Lecatesmlecates@umd.edu 301-405-5197 |
|||||||||||||||
| Rates | UMD $81/hr External Non-profit / University $126/hr Small Commercial / MTECH $166/hr Large Commercial $242/hr No Charge $0/hr |
|||||||||||||||
| Reservations | No upcoming reservations at this time. Please login to make a reservation. |
|||||||||||||||
| External Materials |
If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring. |
|||||||||||||||
| Logs |
|
|||||||||||||||
| SOPs | ||||||||||||||||
| Manuals
You must have reservation permissions to view the manuals. Please login to view manuals. |
||||||||||||||||
| Recipes |
