Dicing saw "A" is operational. If you have been trained to use the saw but can't make reservations, check with John Abrahams to be reauthorized.

Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes,

If you are cleaning afterwards, reserve solvent bench for at least 15 minutes.

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.

For training on the saw, please contact Dr. Daniel Lewis at dlewis17@umd.edu

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.