July 22, 2024 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw A - Microautomation

Dicing saw "A" is operational. If you have been trained to use the saw but can't make reservations, check with John Abrahams to be reauthorized.

Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes,

If you are cleaning afterwards, reserve solvent bench for at least 15 minutes.

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.

For training on the saw, please contact John Abrahams @ 5-5018.

Location FabLab | Dicing Room
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
No Charge
Reservations No upcoming reservations at this time.
Please login to make a reservation.
External Materials

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.

Fri, Jul 19, 2024
3:00 pm - 4:30 pm
Chengdao Yu
View Reservation

Deleted by: Chengdao Yu

Thu, Jul 18, 2024
2:45 pm - 3:15 pm
Jiashen Tang
View Reservation
sapphire wafer dicing
Thu, Jul 18, 2024
1:15 pm - 2:00 pm
Leopoldo Tapia-Aracayo
View Reservation
Thu, Jul 18, 2024
9:45 am - 11:00 am
Leopoldo Tapia-Aracayo
View Reservation
Wed, Jul 17, 2024
10:00 am - 11:30 am
Leopoldo Tapia-Aracayo
View Reservation

Deleted by: Leopoldo Tapia-Aracayo

Records to show:
bkside-07_sop.doc (2.37 MB)
index.php (36 B)

You must have reservation permissions to view the manuals. Please login to view manuals.


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