September 21, 2023 UMD Home NanoCenter AIMLab
Back to Equipment List Dicing Saw A - Microautomation

Dicing saw "A" is operational. If you have been trained to use the saw but can't make reservations, check with John Abrahams to be reauthorized.

Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes,

If you are cleaning afterwards, reserve solvent bench for at least 15 minutes.

This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.

For training on the saw, please contact John Abrahams @ 5-5018.

Location FabLab | Dicing Room
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
No Charge
Reservations No upcoming reservations at this time.
Please login to make a reservation.
External Materials

If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring.

Tue, Sep 19, 2023
11:30 am - 12:30 pm
Andrew Beling
View Reservation
Mon, Sep 18, 2023
7:00 pm - 8:00 pm
Andrew Beling
View Reservation
Mon, Sep 18, 2023
5:30 pm - 6:30 pm
Andrew Beling
View Reservation
cutting 2 sapphire substrates
Mon, Sep 11, 2023
10:00 am - 10:30 am
Yang Zhang
View Reservation
Fri, Sep 08, 2023
4:30 pm - 5:30 pm
Maxwell Xuan
View Reservation
Records to show:
bkside-07_sop.doc (2.37 MB)
index.php (36 B)

You must have reservation permissions to view the manuals. Please login to view manuals.


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