September 25, 2017 UMD Home FabLab AIMLab
Description The STS Deep Reactive ion Etcher uses the Bosch process to cut deep, high aspect ratio channels in silicon. Used primarily for MEMs devices, the only materials permitted in this etcher are silicon wafers, photoresist and thin films of silicon dioxide and silicon nitride. All other materials are prohibited unless approved by FabLab staff.
Location FabLab | ETCH Tunnel
Manufacturer Surface Technology Systems
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
Discussion Link Etching Discussion Page
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Rates
UMD
$71/hr
External Non-profit / University
$108/hr
Small Commercial / MTECH
$150/hr
Large Commercial
$200/hr
Reservations No upcoming reservations at this time.
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Logs
Tue, Aug 29, 2017
5:30 pm - 6:30 pm
Sangwook Chu
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Fri, Aug 25, 2017
1:00 pm - 2:30 pm
Sangwook Chu
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Deleted by: Sangwook Chu

Thu, Aug 24, 2017
1:30 pm - 2:30 pm
Sangwook Chu
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Deleted by: Sangwook Chu

Tue, Aug 22, 2017
9:15 pm - 10:15 pm
Sangwook Chu
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Deleted by: Sangwook Chu

Wed, Aug 02, 2017
9:45 am - 11:00 am
Sangwook Chu
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Records to show:
SOPs
Intro to Plasma Etching.pdf (512.1 KB)
etch-08_etch_rate_check.xls (40 KB)
etch-08_etch_rate_history.xls (40 KB)
etch-08_sop_STS_DRIE.pdf (3.62 MB)
index.php (38 B)
Manuals

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Recipes

STS Etching Recipes

Chamber Clean Procedure.doc (26 KB)
DRIEconditioningrecipe.pdf (182.54 KB)
STS reboot.doc (24.5 KB)

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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