May 26, 2018 UMD Home FabLab AIMLab
Description The STS Deep Reactive ion Etcher uses the Bosch process to cut deep, high aspect ratio channels in silicon. Used primarily for MEMs devices, the only materials permitted in this etcher are silicon wafers, photoresist and thin films of silicon dioxide and silicon nitride. All other materials are prohibited unless approved by FabLab staff.
Location FabLab | ETCH Tunnel
Manufacturer Surface Technology Systems
Staff Contact JonathanJonathan Hummel
jhummel1@umd.edu
301 405-5017
Rates
UMD
$71/hr
External Non-profit / University
$108/hr
Small Commercial / MTECH
$150/hr
Large Commercial
$200/hr
Reservations No upcoming reservations at this time.
Logs
Thu, May 24, 2018
8:15 am - 9:00 am
Michael Yeh
View Reservation
Wed, May 23, 2018
11:30 am - 2:00 pm
Michael Yeh
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Wed, May 23, 2018
9:00 am - 11:00 am
Michael Yeh
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Deleted by: Jonathan Hummel

Fri, May 04, 2018
8:00 am - 2:15 pm
Souheil Nadri
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Wed, May 02, 2018
6:30 pm - 8:00 pm
Sangwook Chu
View Reservation
Records to show:
SOPs
Intro to Plasma Etching.pdf (512.1 KB)
etch-08_etch_rate_check.xls (40 KB)
etch-08_etch_rate_history.xls (40 KB)
etch-08_sop_STS_DRIE.pdf (3.62 MB)
index.php (38 B)
Manuals

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Please login to view manuals or contact the lab staff to obtain permissions.

Recipes

STS Etching Recipes

Chamber Clean Procedure.doc (26 KB)
DRIEconditioningrecipe.pdf (182.54 KB)
STS reboot.doc (24.5 KB)

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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