|Description||The STS Deep Reactive ion Etcher uses the Bosch process to cut deep, high aspect ratio channels in silicon. Used primarily for MEMs devices, the only materials permitted in this etcher are silicon wafers, photoresist and thin films of silicon dioxide and silicon nitride. All other materials are prohibited unless approved by FabLab staff.|
|Location||FabLab | ETCH Tunnel|
Surface Technology Systems
|Discussion Link||Etching Discussion Page
External Non-profit / University
Small Commercial / MTECH
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