Operational Status | ● Online | |||||||||||||||
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Description | The STS Deep Reactive ion Etcher uses the Bosch process to cut deep, high aspect ratio channels in silicon. Used primarily for MEMs devices, the only materials permitted in this etcher are silicon wafers, photoresist and thin films of silicon dioxide and silicon nitride. All other materials are prohibited unless approved by FabLab staff. | |||||||||||||||
Location | FabLab | ETCH Tunnel | |||||||||||||||
Manufacturer |
Surface Technology Systems |
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Staff Contact |
Jonathan Hummel jhummel1@umd.edu 301 405-5017 |
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Rates | UMD $75/hr External Non-profit / University $116/hr Small Commercial / MTECH $158/hr Large Commercial $220/hr No Charge $0/hr |
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Reservations | No upcoming reservations at this time. | |||||||||||||||
Logs |
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SOPs |
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Manuals | You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. |
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Recipes | STS Etching RecipesChamber Clean Procedure.doc (26 KB)DRIEconditioningrecipe.pdf (182.54 KB) STS reboot.doc (24.5 KB) |