September 25, 2017 UMD Home FabLab AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 7-05-2016! Intensity is now 17 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Lithography Discussion Page
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Rates
UMD
$71/hr
External Non-profit / University
$108/hr
Small Commercial / MTECH
$150/hr
Large Commercial
$200/hr
Reservations No upcoming reservations at this time.
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Logs
Sun, Sep 24, 2017
3:00 pm - 3:30 pm
Lara Skibbie
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Sunday
Fri, Sep 22, 2017
1:00 pm - 1:15 pm
Mary Doolin
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Fri, Sep 22, 2017
11:00 am - 11:15 am
Mary Doolin
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Thu, Sep 21, 2017
3:15 pm - 3:30 pm
Lara Skibbie
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Thu, Sep 21, 2017
10:00 am - 10:15 am
Mary Doolin
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Records to show:
SOPs
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)
Manuals

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Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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