June 21, 2018 UMD Home FabLab AIMLab
Back to Equipment List EVG 620 Mask Aligner
Description Note: bulb changed 1-3-2018! Intensity is now 21 mw/cm2

Do NOT turn off after use, use SO use the new track ball and left button

The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. The EVG 620 is fitted with a special fixture which facilitates precise registration of two wafers in the aligner prior to using the EVG 01 Wafer Bonder.
Location FabLab | Photo Tunnel
Manufacturer EVG 620
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Rates
UMD
$71/hr
External Non-profit / University
$108/hr
Small Commercial / MTECH
$150/hr
Large Commercial
$200/hr
Reservations No upcoming reservations at this time.
Logs
Thu, Jun 21, 2018
5:00 pm - 5:15 pm
Christos Tengeris
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Tue, Jun 19, 2018
11:30 am - 1:00 pm
George Banis
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Fri, Jun 15, 2018
3:15 pm - 3:30 pm
Yuntian Zhang
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Fri, Jun 15, 2018
1:30 pm - 1:45 pm
Yuntian Zhang
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Fri, Jun 15, 2018
12:45 pm - 1:00 pm
Yuntian Zhang
View Reservation
Records to show:
SOPs
620Bondalign.pdf (1.01 MB)
620Lithography.pdf (995.56 KB)
index.php (38 B)
photo-05_sop_EVG620_mask_aligner.pdf (86.36 KB)
Manuals

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Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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