|Operational Status||● In maintenance|
EVG- 620 is back in operation with a NEW power supply, new "Y" motion motor and PM.
Note: bulb changed 11-11-2020
Intensity is now 24 mw/cm2
Do NOT turn off after use, use SO use the new track ball and left button
The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron.
|Location||FabLab | Photo Tunnel|
External Non-profit / University
Small Commercial / MTECH
|Reservations||No upcoming reservations at this time.|
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Photoresist ProcessesAZ4620_process.doc (25.5 KB)
NPR9 process.doc (24.5 KB)
NR9-1500PY.pdf (88.62 KB)
SPR220_resist_process.doc (25.5 KB)
baseline_shipley_1813_resist_chlorobenzene_lift.doc (28 KB)
chlorobenzene_lift.doc (28.5 KB)
photo_resist_pouring_procedure.doc (24 KB)
shipley_1813_positive_photolithography_process.doc (27 KB)