| Operational Status | ● In maintenance | |||||||||||||||
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| Description |
EVG- 620 is back in operation with a NEW power supply, new "Y" motion motor and PM.
Note: bulb changed 11-11-2020
Intensity is now 24 mw/cm2
Do NOT turn off after use, use SO use the new track ball and left button The EVG 620 is a two-sided contact alignment and exposure tool. It is configured for 3", 4" and 6" wafers only. Its minimum achievable feature size is approximately one micron. |
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| Location | FabLab |
Photo Tunnel
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| Manufacturer |
EVG 620 |
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| Staff Contact |
 John Abrahamsjabrah@umd.edu 301-405-5018 |
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| Rates | UMD $81/hr External Non-profit / University $126/hr Small Commercial / MTECH $166/hr Large Commercial $242/hr No Charge $0/hr |
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| Reservations | No upcoming reservations at this time. | |||||||||||||||
| Logs |
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| SOPs |
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| Manuals | You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. |
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| Recipes | Photoresist ProcessesAZ4620_process.doc (25.5 KB)NPR9 process.doc (24.5 KB) NR9-1500PY.pdf (88.62 KB) SPR220_resist_process.doc (25.5 KB) baseline_shipley_1813_resist_chlorobenzene_lift.doc (28 KB) chlorobenzene_lift.doc (28.5 KB) photo_resist_pouring_procedure.doc (24 KB) shipley_1813_positive_photolithography_process.doc (27 KB) |
