February 25, 2018 UMD Home FabLab AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Fri, Feb 23, 2018
11:30 am - 12:30 pm
Kelsey Gray
View Reservation
Thu, Feb 22, 2018
8:00 am - 9:00 am
Kelsey Gray
View Reservation
Tue, Feb 20, 2018
1:30 pm - 2:00 pm
John Abrahams
View Reservation
Training Angelique
Thu, Feb 15, 2018
11:00 am - 12:00 pm
Kelsey Gray
View Reservation

Deleted by: Kelsey Gray

Tue, Feb 13, 2018
10:00 am - 11:00 am
Andrew Lamont
View Reservation
Dicing Si wafers
Records to show:
bkside-02_sop.doc (2.37 MB)
index.php (38 B)

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