| Operational Status | ● Waiting for part/service | |||||||||||||||
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| Description |
Dicing saw "B" is not operational. Water faults are intermittent and "STANDBY" button will allow a reset to start again. Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes, If you are cleaning afterwards, reserve solvent bench for at least 15 minutes. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions. |
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| Location | FabLab | Dicing Room | |||||||||||||||
| Manufacturer |
Microautomation |
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| Staff Contact |
 John Abrahamsjabrah@umd.edu 301-405-5018 |
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| Rates | UMD $28/hr External Non-profit / University $44/hr Small Commercial / MTECH $64/hr Large Commercial $150/hr No Charge $0/hr |
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| Reservations | No upcoming reservations at this time. | |||||||||||||||
| Logs |
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| SOPs |
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| Manuals | You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. |
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| Recipes |
