|Operational Status||● Online|
Dicing saw "A" is not reliably operational.
Note: If you need to coat with Photoresist you will need to reserve a spin station for at least 15 minutes,
If you are cleaning afterwards, reserve solvent bench for at least 15 minutes.
This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.
For training on the saw, please contact John Abrahams @ 5-6664.
Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
|Location||FabLab | Dicing Room|
External Non-profit / University
Small Commercial / MTECH
|Reservations||No upcoming reservations at this time.|
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