November 24, 2017 UMD Home FabLab AIMLab
Back to Equipment List Dicing Saw A - Microautomation
Description This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions.
Location FabLab | Tool Prep Area
Manufacturer Microautomation
Staff Contact JohnJohn Abrahams
jabrah@umd.edu
301-405-6664
Discussion Link Backside Discussion Page
Login Help
Rates
UMD
$25/hr
External Non-profit / University
$38/hr
Small Commercial / MTECH
$84/hr
Large Commercial
$124/hr
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Logs
Tue, Nov 21, 2017
2:00 pm - 3:00 pm
Zhongjie Huang
View Reservation
cut Si wafer
Tue, Nov 21, 2017
9:00 am - 9:30 am
John Abrahams
View Reservation
Review for Jiahao
Tue, Nov 14, 2017
2:45 pm - 3:15 pm
YANGYI YAO
View Reservation
Wed, Nov 08, 2017
10:45 am - 12:45 pm
Mitchell Gross
View Reservation
Mon, Nov 06, 2017
4:00 pm - 5:00 pm
Mitchell Gross
View Reservation
Records to show:
SOPs
bkside-02_sop.doc (2.37 MB)
index.php (38 B)
Manuals

You must have lab permissions to view the manuals.

Please login to view manuals or contact the lab staff to obtain permissions.

Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

Communicate Contact Us
Contact the Webmaster
Google+
Follow us on TwitterTwitter logo

Links Privacy Policy
Sitemap
RSS

Copyright The University of Maryland University of Maryland
2004-2017