| Description |
Currently not in operation.
This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials.
For training on the saw, please contact John Abrahams @ 5-6664.
Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions. |
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| Location | FabLab | Tool Prep Area | |||||||||||||||
| Manufacturer |
Microautomation |
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| Staff Contact |
 John Abrahamsjabrah@umd.edu 301-405-6664 |
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| Rates | UMD $25/hr External Non-profit / University $38/hr Small Commercial / MTECH $84/hr Large Commercial $124/hr |
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| Reservations | No upcoming reservations at this time. | |||||||||||||||
| Logs |
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| SOPs |
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| Manuals | You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. |
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| Recipes |
