Operational Status | ● Online | |||||||||||||||
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Description | Currently not in operation. This fully programmable dicing saw can be used for precision cutting of wafer-sized substrates, including silicon, III-V materials, quartz, Pyrex and similar materials. For training on the saw, please contact John Abrahams @ 5-6664. Blades will now be issued for each reservation. You will pay for replacements if broken. No exceptions. | |||||||||||||||
Location | FabLab | Tool Prep Area | |||||||||||||||
Manufacturer |
Microautomation |
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Staff Contact |
John Abrahams jabrah@umd.edu 301-405-5018 |
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Rates | UMD $25/hr External Non-profit / University $38/hr Small Commercial / MTECH $58/hr Large Commercial $124/hr |
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Reservations | No upcoming reservations at this time. | |||||||||||||||
Logs |
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SOPs |
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Manuals | You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. |
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Recipes |