| Description |
The Karl Suss MA-4 Mask Aligner is used with substrates up to 4" (100mm) in diameter. It also works for smaller samples. It is a contact/proximity aligner and can be set to utilize either 365 nm or 405 nm light. It is used with a variety of both positive and negative photoresists. Recipes for our standard photoresist processing are attached to the back of the operating instructions below. This system also offers real-time infrared through-wafer backside alignment. |
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| Location | FabLab |
Photo Tunnel
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| Manufacturer |
Karl Suss MA-4 |
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| Staff Contact |
 John Abrahamsjabrah@umd.edu 301-405-6664 |
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| Discussion Link | Lithography Discussion Page Login Help |
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| Rates | UMD $70/hr External Non-profit / University $108/hr Small Commercial / MTECH $150/hr Large Commercial $200/hr |
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| Reservations | No upcoming reservations at this time. Please login to make a reservation. |
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| Logs |
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| SOPs |
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| Manuals | You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. |
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| Recipes | Photoresist ProcessesAZ4620_process.doc (25.5 KB)NPR9 process.doc (24.5 KB) NR9-1500PY.pdf (88.62 KB) SPR220_resist_process.doc (25.5 KB) baseline_shipley_1813_resist_chlorobenzene_lift.doc (28 KB) chlorobenzene_lift.doc (28.5 KB) photo_resist_pouring_procedure.doc (24 KB) shipley_1813_positive_photolithography_process.doc (27 KB) |
