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ABSTRACT:
To meet the growing demand for integrated circuits (ICs) in increasingly complex and demanding applications, the semiconductor industry has evolved dramatically during the past few decades. Military, space, and avionic electronics must survive harsh environmental conditions, requiring highly reliable specialized packaging such as 2.5D/3D hetero integration (HI) for greater functionality, device density, and speed. Thus, cross-coupled chip-package-board interactions (CPBIs) result from the proximity of a wide variety of active and passive components, material stacks, and processes. This seminar will provide insights into the emerging electrical reliability challenges of a 2.5D/3D packaged IC and offer potential solution schemes to ensure reliable IC operation under the most stringent conditions.
ABOUT THE SPEAKER:
Professor Alam is the Jai N. Gupta Distinguished Professor at Purdue University, where his research focuses on the reliability physics of semiconductor devices. From 1995 to 2003, he worked at Bell Laboratories in Murray Hill, NJ, focusing on transistor reliability issues, including NBTI and TDDB. Since joining Purdue in 2004, Dr. Alam’s research has expanded to include the reliability of self-heated logic and power transistors, as well as chip-package interaction in harsh/extreme environments. He is a fellow of IEEE, APS, and AAAS. His awards include the 2006 IEEE Kiyo Tomiyasu Field Medal for his contributions to device technology, the 2015 SRC Technical Excellence Award for his fundamental contributions to reliability physics, and the 2018 IEEE EDS Award for his work in educating, inspiring, and mentoring electron device professionals worldwide. More than 500,000 students worldwide have learned some aspects of semiconductor devices from his web-enabled courses.
LOCATION: CEE Conference Room 1179, Martin Hall
DATE AND TIME: Tuesday, September 9, 2025|1:50 pm – 2:50 pm
JOIN ONLINE: https://umd.zoom.us/j/98524756873?pwd=dF31h6pbNftkPO2Tk2XMldulV0iLhc.1
CONTACT: Prof. Michael Pecht
September 4, 2025
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