May 26, 2018 UMD Home FabLab AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Thu, May 24, 2018
5:00 pm - 5:15 pm
Gang Li
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Thu, May 24, 2018
12:30 pm - 5:00 pm
Sarit Zhukovsky
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Deleted by: Sarit Zhukovsky

Thu, May 24, 2018
10:30 am - 12:30 pm
Mijin Kim
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Deleted by: Thomas Loughran

Mon, May 21, 2018
10:45 am - 11:00 am
Gang Li
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Wed, May 16, 2018
3:30 pm - 4:45 pm
Erin Cleveland
View Reservation
O2 etch
Records to show:
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)

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