January 21, 2018 UMD Home FabLab AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Please login to make a reservation.
Fri, Jan 19, 2018
1:00 pm - 2:00 pm
David Shahin
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Thu, Jan 18, 2018
2:00 pm - 3:00 pm
David Shahin
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Deleted by: David Shahin

Tue, Jan 16, 2018
7:15 pm - 8:45 pm
Changmin Lee
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InP etching
Tue, Jan 16, 2018
5:00 pm - 6:00 pm
Yu Shi
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Tue, Jan 16, 2018
11:15 am - 11:30 am
Lara Skibbie
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Records to show:
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)

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