September 25, 2017 UMD Home FabLab AIMLab
Back to Equipment List Oxford ICP Etcher(Chlorine)
Description This Oxford Plasmalab System 100 is an Inductively Coupled Plasma (ICP) reactive ion etcher. Gases plumbed to the system include:
  • Cl2, O2
  • SiCl4, SF6
  • CH4, Ar
  • H2, N2
This etcher is used primarily for etching III-V materials and aluminum.

The standard operating procedure for this tool is loaded into the PC that supports the ICP etcher.
Location FabLab | ETCH Tunnel
Manufacturer Oxford Instruments
Staff Contact ThomasThomas Loughran
Discussion Link Etching Discussion Page
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External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
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Fri, Sep 22, 2017
4:30 pm - 5:00 pm
Rodney Snyder
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Tue, Sep 19, 2017
1:45 pm - 2:00 pm
Rodney Snyder
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Fri, Sep 15, 2017
1:15 pm - 1:45 pm
Christie Trimble
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Thu, Sep 14, 2017
5:45 pm - 6:00 pm
Christie Trimble
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Wed, Sep 13, 2017
12:30 pm - 2:00 pm
David Shahin
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Manual diamond etch process w/ Mark - chamber pumping down.
Records to show:
Oxford Chlorine Etcher SOP.pdf (384 KB)
index.php (38 B)

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