May 26, 2018 UMD Home FabLab AIMLab
Back to Equipment List Oxford PECVD
Description This Oxford Plasmalab System 100 is a Plasma Enhanced Chemical Vapor Deposition (PECVD) system. It is used to deposit low-stress thin films with excellent step coverage on a variety of samples at low temperatures (generally 200 - 300 O C). These thin films include:
  • SiO2 (both TEOS and SiH4-based)
  • SiNx
  • SiON
  • Α - Si
Location FabLab | CVD Tunnel
Manufacturer Oxford Instruments PlasmaLab System 100
Staff Contact ThomasThomas Loughran
External Non-profit / University
Small Commercial / MTECH
Large Commercial
Reservations No upcoming reservations at this time.
Thu, May 24, 2018
12:30 pm - 1:00 pm
Hua Xie
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Thu, May 24, 2018
10:30 am - 11:30 am
Mijin Kim
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Deleted by: Thomas Loughran

Wed, May 23, 2018
9:30 am - 9:45 am
Aysanew Abate
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Tue, May 22, 2018
3:30 pm - 4:30 pm
Boyang Liu
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Tue, May 22, 2018
1:00 pm - 2:30 pm
Weiwei Ping
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2um and 3um a-Si depositions.
Records to show:
Oxford PECVD SOP.pdf (709.05 KB)
index.php (38 B)

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