November 24, 2017 UMD Home FabLab AIMLab
Back to Equipment List Stress Measurement Tool
Description

The Flexus 2320 Stress Measurement Tool is used to measure stress in thin films. Silicon wafers are used as substrates for thin films. These films can be deposited by a variety of chemical vapor deposition, thermal or electron beam evaporation, sputtering or furnace growth. By optically measuring the change in the radius of curvature of the silicon substrate, both tensile and compressive stresses in thin films can be accurately determined.

This tool uses a laser. DO NOT LOOK DIRECTLY INTO THE LASER BEAM OR TRY TO DEFEAT ANY SAFETY INTERLOCKS. Do not attempt to change any calibration settings or laser alignment. Notify any FabLab staff member for help.

Location FabLab | Main Fab Hall
Manufacturer Flexus 2300
Staff Contact ThomasThomas Loughran
tcl@umd.edu
301-405-3642
Discussion Link Metrology Discussion Page
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SOPs
index.php (38 B)
met-02_sop_stress_measurement_Flexus_2320.pdf (3.94 MB)
Manuals

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Recipes

Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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