September 25, 2017 UMD Home FabLab AIMLab
Description The Trion RIE is used to remove photoresist residue. Plumbed with O2,CF4 and Sf6 the Etcher is an aggressive etcher for any organic material. Can be used to etch thin layers of SiO2 ,SiN and Si
Location FabLab | ETCH Tunnel
Manufacturer
Staff Contact MarkMark Lecates
mlecates@umd.edu
301-405-5197
Discussion Link Etching Discussion Page
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Rates
UMD
$71/hr
External Non-profit / University
$108/hr
Small Commercial / MTECH
$150/hr
Large Commercial
$200/hr
Reservations No upcoming reservations at this time.
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Logs
Tue, Sep 05, 2017
2:30 pm - 2:45 pm
Hee Sup Shin
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Thu, May 11, 2017
9:30 am - 10:15 am
Qian Wang
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1. Power 100 Watts 2. 200 mTorr 3. CF4 flow rate of 20 SCCM 4. Time of 40 seconds
Fri, Apr 14, 2017
10:45 am - 11:00 am
Zhongjie Huang
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Wed, Apr 12, 2017
12:00 pm - 12:15 pm
Christiane Ebongue
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Mon, Mar 06, 2017
7:45 pm - 8:00 pm
Hyun-Tae Kim
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Deleted by: Hyun-Tae Kim

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Colleges A. James Clark School of Engineering
The College of Computer, Mathematical, and Natural Sciences

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